Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.
-
18 Replies 9756 Views
Version 4.1 Low-Frequency ElectromagneticsModeling Tools & DefinitionsParameters, Variables, & Functions
Alex Golberg posted 1 decade ago reply 1 decade ago by Sharanya Arcot Desai
-
1 Replies 3245 Views
Version 3.5a RF & Microwave EngineeringModeling Tools & DefinitionsParameters, Variables, & FunctionsStudies & Solvers
Zhe Wang posted 1 decade ago reply 1 decade ago by Shakeeb Bin Hasan
-
1 Replies 1181 Views
Chris McCorquodale posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
-
0 Replies 1375 Views
Version 3.5a
Edouard Nesvijski posted 1 decade ago
-
0 Replies 1791 Views
Version 4.1
Pengxin Zhang posted 1 decade ago
-
1 Replies 3490 Views
Version 4.0a Acoustics & VibrationsStructural Mechanics
User COMSOL posted 1 decade ago reply 1 decade ago by Ivar KJELBERG
-
0 Replies 2423 Views
Version 4.1 Low-Frequency Electromagnetics
Tonis Hobejogi posted 1 decade ago
-
How can i model semiconductor and its packaging in Comsol using CAD and test under electrical, mechnical and thermal aspect.
read0 Replies 1164 ViewsRashedul Karim posted 1 decade ago
-
0 Replies 791 Views
Rose posted 1 decade ago
-
0 Replies 1763 Views
Version 4.1 Structural Mechanics
Yong LI posted 1 decade ago
