传热中的传导、对流和辐射模拟

    <span style="line-height:1.8;font-family:Microsoft YaHei;font-size:24px;">主题介绍: </span><br />

传热情况是验证及优化产品和系统设计的关键。开发反应器及电子类器件时,同样要考察其中的热及机械属性。传导、对流及辐射传热都可能造成温度场的变化,每种模式的重要性如何?精确的仿真需要考虑哪些方面?本次网络研讨将逐一为您解答这些问题,并将现场演示如何借助 COMSOL Multiphysics® 模拟传热。网络研讨会设有答疑环节。

    <span style="line-height:1.8;font-family:Microsoft YaHei;font-size:24px;"> 网络研讨会详情:</span><br />

日期:2016年3月9日 14:00-15:00
状态:已结束

    <span style="line-height:1.8;font-family:Microsoft YaHei;font-size:24px;">演讲者:</span><br />

施翀
COMSOL 中国应用工程师 
毕业于复旦大学材料科学系材料工程专业,研究不锈钢的电化学防腐蚀,多年的 CAE 仿真经验,主要涉及领域为电化学、传热、化工、流体等。

    <span style="line-height:1.8;font-family:Microsoft YaHei;font-size:24px;">登录后可浏览该网络研讨会的完整录制视频。</span> 


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