COMSOL Day: Version 6.4

COMSOL Multiphysics^® version 6.4 delivers significant advancements in modeling capabilities, productivity, and overall simulation performance. One major addition is the new functionality for structural explicit dynamics, which supports nonlinear dynamic analysis using explicit time integration. This makes it possible to efficiently model high-speed events, including impacts, blasts, and drop tests, with robust mechanical contact handling.

The release also introduces the Granular Flow Module, enabling high-fidelity simulation of grain and powder behavior in processes like conveying, mixing, and additive manufacturing. Solver performance has been greatly enhanced through the new NVIDIA CUDA® direct sparse solver (cuDSS) for NVIDIA^® GPUs, providing severalfold speedups for both single-physics and multiphysics simulations.

Usability and workflow efficiency are further enhanced with expanded large language model (LLM)–assisted simulation. The Chatbot window now connects to GPT-5™, DeepSeek™, Google Gemini™, Anthropic Claude™, and other OpenAI API-compatible models, providing interactive, model-aware guidance that integrates COMSOL documentation with detailed information on model definitions.

Attend this session to learn more about these updates and other major news in COMSOL Multiphysics^® version 6.4.

COMSOL Multiphysics^® version 6.4 introduces significant enhancements for structural mechanics and acoustics simulations. In the Structural Mechanics Module, new explicit dynamics capabilities for solids and trusses enable the simulation of fast, transient, and highly nonlinear events such as impact, wave propagation, and metal forming. To simplify the setup of models with many potential contact interactions, a new automated contact modeling approach has been introduced that creates contact conditions between multiple objects without manual specification. The Nonlinear Structural Materials Module adds support for nonlinear material models and phase-field damage modeling for explicit dynamics, along with a faster Hencky strain decomposition for inelastic strain computations.

In the Composite Materials Module, improved modeling for layered shells supports variable-angle fiber laminates, enhanced formulations for failure criteria, and better coupling between layered shells and solid structures. The Rotordynamics Module introduces a new Rotating Frame feature for solid rotor interfaces, extended functionality for dynamic coefficients for bearing analyses, and an option for mode tracking in eigenfrequency studies used to generate Campbell diagrams. The Multibody Dynamics Module introduces a new modeling tool for easier handling of mechanical joints.

The Acoustics Module now offers multi-GPU support for time-explicit pressure acoustics, CGNS flow data import for aeroacoustics modeling, a new Poroacoustics feature for transient and time-explicit pressure acoustics, and a dedicated periodic port boundary condition for automated handling of diffraction orders.

Attend this session to learn more about these updates in COMSOL Multiphysics^® version 6.4.

COMSOL Multiphysics^® version 6.4 includes a set of important updates for fluid flow and heat transfer simulations. In the CFD Module, enhanced turbulence modeling introduces scale-adaptive simulation (SAS) for the shear stress transport (SST) turbulence model, providing accurate time-dependent flow predictions. In addition, this version includes an Elliptic Blending R-ε turbulence model for improved near-wall fidelity, along with support for new reacting flows with large eddy simulation (LES) that couples mixing, heat transfer, and chemical reactions.

The Mixer Module adds a rotating frame feature as an efficient alternative to full rotating domain setups, as well as algebraic turbulence models for high Mach number flows in rotating machinery. The Polymer Flow Module introduces process modeling for curing processes in both fluids and solids. Porous media flow capabilities common to many add-on modules now support periodic conditions between boundaries and pressure jumps across free–porous interfaces, enhancing modeling of subsystems and representative volume elements.

The Heat Transfer Module adds support for refraction in radiative heat transfer and improved modeling of thermal radiation in participating media. The Metal Processing Module now includes functionality for induction hardening of steel parts and new tools for modeling the austenitization of steel phases.

Join this session to learn more about these updates in COMSOL Multiphysics^® version 6.4.

COMSOL Multiphysics^® version 6.4 includes a set of important updates for chemical and electrochemical simulations. Power loss variables now make it easy to evaluate the magnitude of total power losses in a battery cell and compare losses among individual components, such as the separator, electrode, and current conductor, in order to assess efficiency and identify dominant loss mechanisms (due to ohmic, activation, and concentration overpotentials). A new feature is available for defining arbitrary charge–discharge load cycles, enabling realistic charging, discharging, and operating sequences and supporting more detailed analysis of performance under practical conditions.

For chemical reaction engineering, version 6.4 brings unprecedented accuracy to the modeling of turbulent reacting systems with reacting flow functionality for large eddy simulations (LES). For applications such as pharmaceutical manufacturing and advanced materials processing, accurate modeling of particle growth, morphology, and breakage is made possible with new support for particle aggregation and breakage. This functionality enables realistic simulation of evolving particle-size distributions in crystallization, precipitation, and granulation processes. Additionally, a new moving-bed reactor feature makes it possible to model heterogeneous reactors where the solid phase is continuously consumed and replenished.

In this session, we will take a closer look at these updates.

COMSOL Multiphysics^® version 6.4 introduces significant improvements for electromagnetics modeling. In the AC/DC Module, induction boundary conditions are now supported for time-domain modeling, and magnetomechanics analysis can be performed for thin structures. The RF Module and the Wave Optics Module introduce new functionality for analyzing far-field radiation in the presence of a substrate.

The Ray Optics Module includes new scattering options for light–tissue interactions, humid environments, and other scenarios involving multiple scattering dynamics. An extended material property set for glasses provides all parameters required to perform structural-thermal-optical performance (STOP) analysis.

As for device-level simulation, updates to the Semiconductor Module include new functionality for modeling ferroelectric and piezoelectric semiconductors as well as easier multiphysics modeling of novel semiconductor architectures, such as memristors.

The Electric Discharge Module offers improved stability and computational efficiency for electric discharges, including switching arc simulations.

Join this session to learn more about these updates in COMSOL Multiphysics^® version 6.4.