November 28–29

COMSOL Conference Bangalore 2019

You are invited to attend the COMSOL Conference 2019 to advance your numerical simulation skills and connect with fellow modeling and design experts. This event focuses on multiphysics simulation and its applications. A great variety of sessions offer everything from inspiring keynotes by industry leaders to 1-on-1 discussion with application engineers and developers. You can customize the program to your specific needs, whether the purpose is learning new modeling techniques or connecting with fellow users of the COMSOL® software. Join us at the COMSOL Conference to:

  • Stay up-to-date with current multiphysics modeling tools and technologies
  • Pick up new simulation techniques in a variety of minicourses and workshops
  • Present a paper or poster and gain recognition for your design and research work
  • Interact with your colleagues in industry-specific panel discussions
  • Get assistance for your modeling problems at demo stations
  • Learn how to build and deploy simulation applications for your team or organization
  • Draw inspiration for your next design innovation from leaders in multiphysics simulation
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Schedule November 28-29

9 a.m.
Registration Opens
10 a.m.
Introduction to COMSOL Multiphysics®
10:45 a.m.
11 a.m.
Welcome and Keynotes
  • Vineet Dravid is the director of India operations at COMSOL. He has been working with COMSOL since 2006, first in the Boston office and in the Bangalore office since 2009. He received his PhD in mechanical engineering from Purdue University in 2006.

  • Hyperelastic materials, such as polymer, are widely used for diverse structural and electrical applications ranging from sealings in cables to heavy load dampers in aviation. The most unique property of hyperelastic materials is the ability to experience large expansion and compression and retain an initial configuration without a considerable permanent set. Cable joints are used to insulate the open part joints of high-voltage and large-capacity power lines, as well as protect against moisture and dust ingress along with mechanical and electrical protection. Cable joint materials consist of multiple layers with the innermost layer having conductive properties, the middle layer with semiconductive properties, and the outer insulating layer. In this research work, a baseline mathematical model has been developed based in the Nonlinear Structural Materials Module, an add-on to COMSOL Multiphysics®, with the help of experimental data available in the form of uniaxial and biaxial stress-strain curves. A least square regression model is fitted with various hyperelastic models such as Mooney–Rivlin, Yeoh, Ogden, and Neo–Hookean, to design the best suitable hyperelastic model for the optimization of material properties and design parameters. The model is used to simulate up to 7x the expansion of a cable joint for calculating the hoop stresses and pressure acting and studying the change in configuration during expansion to design the holdout. The model is further used as a platform for the design and development of heavy duty elastomer springs developed by Raychem RPG and a cable gland shroud to predict their behavior and help in fine-tuning the material properties for best performance.

  • Modeling and simulations are seen as an alternate approach of inquiry and disparate to the experimentation as a research methodology. However, on the contrary, the best use of these methodologies is in fact in tandem and can often be complementary approaches, filling in for the limitations of either. There is also emerging evidence that in several instances, a "digital first" approach has yielded valuable insights and results for a variety of problems of interest across the design board, work bench, and plant. Specific problems of design and engineering (e.g., product engineering in medical devices) have been well represented, analyzed, and addressed purely from a modeling and simulations approach, before the first material is cut or shaped.

    The presentation will make a pitch for promoting modeling and simulations in solving industry-relevant problems, guiding phenomenological understanding, designing products, and engineering safety. The case studies discussed will exemplify the use of modeling and simulations in the context of charge adsorption on electrified interfaces, fluid flow for controlled liquid dosing, and predicting steady-state concentrations in diffusion and convection of a gas.

12:40 p.m.
1:45 p.m.
  • In this minicourse, you will learn about modeling conductive, convective heat transfer and about phase change using the COMSOL Multiphysics® software, Heat Transfer Module, CFD Module, and Subsurface Flow Module.

    Conductive heat transfer modeling addresses heat transfer in domains and can include heat transfer in thin layers, contact thermal resistance. Convective heat transfer addresses heat transfer due to motion, especially in fluids but also in solids. We will show you how to model natural convection induced by buoyancy forces. We will also discuss how lumped thermal equivalent circuit components can be used for heat transfer analysis, and how they can be coupled to the heat transfer FE models.

    Additionally, changes in the temperature of a material can lead to a phase change. This minicourse will present two methods that can be used to model phase change and account for the latent heat of phase change. These two methods, the apparent heat capacity method and the Stefan’s condition, can be used with COMSOL Multiphysics®.

  • Get an overview of the general functionality for laminar flow in the CFD Module, followed by a detailed description of the functionality added with the Microfluidics Module. The Microfluidics Module features custom interfaces for the simulation of microfluidic devices. Single-phase flow capabilities include both Newtonian and non-Newtonian flow. Beyond the single-phase flow capabilities, the Microfluidics Module also allows for two-phase flow simulations to capture surface tension forces, capillary forces, and Marangoni effects. Typical applications include lab-on-a-chip (LOC) devices, digital microfluidics, electrokinetic and magnetokinetic devices, inkjets, and vacuum systems.

  • In this minicourse, you will learn different approaches for modeling layered shells in COMSOL Multiphysics®. The Layered Shell interface will be covered in detail, including the modeling of delamination. You will also learn how to extract homogenized material properties from a micromechanical model using a representative volume element approach. Finally, the analysis of multiphysics problems in layered shells will be discussed.

  • The high-fidelity simulation of optical systems in particularly harsh environments must account for the impact of thermal and structural effects on optical performance. For example, the large temperature changes found in outer space and high-powered laser focusing systems can change the refractive indices due to thermo-optic dispersion. Under extreme conditions, the elements of the optical system may experience significant thermal stress, causing physical deformation and a further degradation of the image quality.

    In this minicourse, you will learn how to use the Ray Optics Module to perform coupled structural-thermal-optical performance (STOP) analyses of optical systems. You will learn how to use COMSOL Multiphysics® to compute temperature and displacement fields using the finite element method (FEM) and then couple these fields to a ray optics simulation using built-in optical dispersion models. The distinction between unidirectional and bidirectional couplings in STOP analysis models will also be explained.

  • Many different physical phenomena are coupled to the deformation of solids. In this minicourse, you will get an overview of how to model fluid-structure interaction, thermal stresses and thermoelastic damping, electromechanical forces, magnetostriction, piezoelectricity, poroelasticity, and acoustic-structure interaction. The built-in multiphysics couplings are highlighted, together with examples of how to create your own couplings.

  • In this minicourse, you will learn how to define chemical kinetics, thermodynamic properties, and transport properties for models of reacting systems using the Chemical Reaction Engineering Module. We will address topics including homogeneous and surface reactions, diffusion and convection in diluted and concentrated solutions, thermal effects on transport and reactions, and mass and heat transfer in heterogeneous catalysis.

3:15 p.m.
3:30 p.m.
User Presentations
4:45 p.m.
5 p.m.
Minicourses and Panel Discussion
  • Description
    Engineering education today is at a crossroads. On the one hand is the challenge of keeping students engaged in class and ensuring they understand basic concepts, while they are inundated with information over the internet. On the other hand, curricula in traditional engineering disciplines are in need of an overhaul as multi-disciplinary engineering has become the need of the day, with an increased focus on the pace of innovation.

    It is imperative that new technology be used to handle these new challenges. In the realm of physics- and engineering-based courses, simulation applications are helping to strike such a balance by introducing students to complex concepts in a simplified format. During this session, you will learn how multiphysics models can be developed into specialized applications for teaching, enabling you to create a virtual lab during lecture sessions. Explore how easy-to-use apps enhance classroom learning, helping students visualize theoretical concepts.

    Join your peers in a panel discussion where you can see how your colleagues use apps to engage students, accelerating the learning process. The session will also give you an opportunity to know first-hand how students have benefited from apps used in their curriculum.


    Prof. Amol Deshpande, Birla Institute of Technology & Sciences Pilani, Goa Campus
    Dr. R Venkataraghavan, Unilever R&D Bangalore
    Prof. Ram Bharthi, Indian Institute of Technology, Roorkee
    Prof. Mayank Shrivastava, Indian Institute of Science, Bangalore

  • The Application Builder, included in the COMSOL Multiphysics® software, allows you to wrap your COMSOL Multiphysics® models in user-friendly interfaces. This minicourse will cover the two main components of the Application Builder: the Form Editor and the Method Editor. You will learn how to use the Form Editor to add buttons, sliders, input and output objects, and more. You will also learn how to use the Method Editor and other tools to efficiently write methods to extend the functionality of your apps.

  • Importing CAD designs often involves modifying the geometry after the import; for example, to remove unwanted details, create additional computational domains, or even restore missing faces. Besides demonstrating the tools for these tasks, this minicourse will also cover best practices for working with imported CAD geometries and how to interface CAD software using the LiveLink™ interface for an efficient optimization of CAD designs.

  • Attend this minicourse to learn about the tools for generating geometry with COMSOL Multiphysics®. We will cover how to efficiently build geometry that can be parameterized and look into more advanced techniques; for example, how to create a geometry from simulation results. Generating a geometry also involves preparing selections for physics settings. By using the right selection tools, you can easily automate the modeling workflow, even when this involves simulations on widely different versions of a geometry.

  • Shape optimization involves the free-form deformation of your CAD part via the Deformed Geometry interface. It is possible to set up such a deformation with respect to just a few control variables, and use these variables within the gradient-based optimization capabilities of the Optimization Module to quickly come up with improved designs. Often, setting up such a deformation can be quite challenging. Come learn how to efficiently set up and solve such models.

  • In this minicourse, we will walk you through the meshing techniques that are available to you in the COMSOL Multiphysics® software. We will introduce you to basic meshing concepts, such as how to tweak the meshing parameters for unstructured meshes. More advanced topics include working with swept meshes and creating mesh plots. You will also learn a useful technique for meshing imported CAD designs: How to hide small geometry features from the mesher.

6:30 p.m.
Poster Session
8 p.m.
Gala Dinner
8 a.m.
9 a.m.
  • The first part will describe radiative heat transfer that is one of the three types of heat transfer and that plays a major role in many applications. During this session, we will focus on the features for modeling surface-to-surface radiation for gray surfaces or multiple spectral bands, such as solar and infrared radiation. We will discuss different examples in order to help identify cases where thermal radiation has to be accounted for.

    The second part will address heat and moisture transport. The evaporation and condensation of water are very common. In addition to the relation between moisture and possible unwanted effects (like material damage or mold formation), water condensation and evaporation plays a role in energy balance because. This minicourse will present the predefined physics and multiphysics features that are available to model these effects.

  • In this minicourse, you will learn how to define and solve problems in electrodeposition, corrosion protection, and corrosion studies. These systems all involve mass and charge transfer coupled to electrochemical reactions at deforming metal surfaces. We will look at two different approaches: one that treats the surface deformation as a variable and a second approach that treats the surface deformation with moving mesh. The most common type of study for these systems is the time-dependent study, but we will also briefly look at electrochemical impedance spectroscopy (EIS) studies.

  • In this minicourse, we will study different classes of problems involving acoustic propagation in fluids and solids, ranging from propagation in large domains, such as rooms or the ocean, to transmission through small perforations, where thermal and viscous losses are important. We also discuss modeling the interaction of elastic waves in solids and pressure waves in fluids (ASI) as well as propagation in moving fluids; that is, convected acoustics or aeroacoustics. You will also learn about recent news and additions to the COMSOL Multiphysics® software relevant to acoustics. Application areas include, but are not limited to, muffler design, sound insulation materials, room and car acoustics, flow meters, and liners.

  • Magnetic fields arise due to magnets and the flow of current. In this minicourse, you will learn about using the AC/DC Module to model static, transient, and frequency-domain magnetic fields that arise around magnets and coils. We will introduce various ways of modeling magnetically permeable materials, motors, and generators.

  • This minicourse is focused on modeling joints, gears, cams, springs, and dampers in flexible multibody systems. You will also get an introduction to including nonlinear materials, using lumped modeling techniques, and modeling the multiphysics of such systems. In addition, we will cover the dynamics and stability of rotors and rotating components. You will learn techniques for modeling rotors and associated components using both solid and beam elements, as well as various methods for modeling bearings and foundations. If you are interested in learning about the Multibody Dynamics Module and the Rotordynamics Module, this minicourse is for you.

10:30 a.m.
10:45 a.m.
User Presentations
11:45 a.m.
12 p.m.
Keynotes and Awards Ceremony
  • Legislation for air pollution and carbon dioxide emission targets have accelerated the development of hybrid and electric vehicles. With the rising demand for innovative design methodologies in electric vehicle manufacturing, advances in battery technology have become increasingly important. This session will focus on the critical role played by simulation in the entire battery design and integration process both for battery manufacturers as well as users. Panelists will discuss issues of importance such as battery life prediction, capacity fade and thermal runaway and how simulation can be used to optimize battery performance at both the cell and pack level.

  • In this session, you will see how the RF Module, a high-frequency electromagnetic simulation add-on, in the COMSOL Multiphysics® software, can help your future design of 5G and Internet of things (IoT) applications and satellite communication.

  • Computational Research for Energy Transition by Shantanu Maheshwari, Shell Technology Centre
  • Pranit Mehta is currently the Team Head of Avishkar Hyperloop, a student team of IIT Madras. Having joined the team a few months after its formation, he has now been selected to head the 40+ member team. He majorly looks on to the Team Management, Sponsorship, Marketing and other Business aspects of the team. Along with this, he is a member of MENSA, an International high IQ Society and given a TEDx talk as well. He is currently pursuing his third year of B. Tech in the Department of Engineering Design, IIT Madras.

    Parth Shah heads the research and development of linear induction motors and works with the controls team of Avishkar Hyperloop, he has been a part of Avishkar Hyperloop since its inception in September 2017. As the lead of the LIM team, he manages the subsystem, creates and verifies simulations for the LIM, and also designs the prototypes and experimental setups for the same. Apart from this, he has also been a coordinator at Shaastra, IIT-M's technical fest, and is a member of the Institute basketball team. He is currently pursuing his third year of B. Tech in the Department of Electrical Engineering, IIT Madras.

1:45 p.m.
2:45 p.m.
  • In this minicourse, you will learn how to model batteries with a focus on lithium-ion batteries, including transport of ions, porous electrodes, and electrode reactions. You will also get an introduction to the corresponding couplings to heat transport for performing thermal simulations. We will address how to simulate various transient phenomena, such as constant current-constant voltage (CCCV) charge/discharge cycling, electrochemical impedance spectroscopy (EIS), and capacity fade.

  • In this minicourse, we will address the modeling of resistive and capacitive devices with the AC/DC Module. We will also cover the calculation of electric fields under steady-state, transient, and frequency-domain conditions, as well as the extraction of lumped parameters such as capacitance matrices. Applications include the modeling of resistive heating and sensor design.

  • This minicourse is focused on modeling all kinds of transducers. The transduction from an electric signal to an acoustic signal, including the mechanical path, is a true multiphysics application. We will set up a simple model using the built-in multiphysics couplings and also look at other modeling techniques, like combining lumped models with FEM or BEM. The analysis can be done in the frequency domain or extended to the time domain, where nonlinear effects can be included. You will also learn about recent news and additions to the COMSOL Multiphysics® software relevant to the topic. Application areas include, but are not limited to, mobile devices, piezotransducers, loudspeakers, headsets, and speaker cabinets.

  • Learn how to use the Application Builder and the Method Editor to automate your model building, including setting up the geometry, material properties, loads, and boundary conditions; meshing; solving; and extracting data. You will learn how the Application Builder can be a powerful tool in your modeling process.

  • Learn how to efficiently simulate incompressible and compressible turbulent flows. The CFD Module allows for accurate multiphysics flow simulations, such as conjugate heat transfer with nonisothermal flow and fluid-structure interactions. Physics interfaces for simulating high Mach number flow, flow in porous media, thin-film flow, and flow in stirred vessels with rotating parts will also be presented. This is followed by a description of the different turbulence models and their applicability to various types of flow problems.

  • In this minicourse, we will cover the use of the RF Module and Wave Optics Module for simulating Maxwell's equations in the high-frequency electromagnetic wave regime. We will discuss applications in resonant cavity analysis, antenna modeling, transmission lines and waveguides, periodic structures, and scattering. Then, we will address the coupling of electromagnetic wave simulations to heat transfer, such as in RF heating.

4:15 p.m.
4:30 p.m.
  • Looking to increase your productivity when using the COMSOL® software? From setting up to postprocessing your COMSOL models, this session will showcase time-saving techniques. Regardless of your engineering field, following best practices will help you get the most out of your modeling efforts, efficiently.

  • COMSOL Multiphysics® gives you precise control over the way in which your multiphysics models are solved. It also includes a set of powerful implicit time-stepping algorithms for fast and accurate solutions to transient models. In this minicourse, we will cover the fundamental numerical techniques and underlying algorithms used for steady-state models and explain the reasons behind the default solver settings. Building upon this knowledge, you will learn various techniques for achieving or accelerating convergence of nonlinear multiphysics models.

  • When presenting your results, the quality of the postprocessing will determine the impact of your presentation. This minicourse will thoroughly explore the many tools in the Results node designed to make your data look its best, including mirroring, revolving symmetric data, cut planes, cut lines, exporting data, joining or comparing multiple data sets, as well as animations.

Conference Venue

ITC Gardenia

1, Residency Road, Shanthala Nagar,
Ashok Nagar, Bengaluru,
Karnataka 560025

Get Directions


From Kempegowda International Airport
The hotel is 39 km from the Kempegowda International Airport. You could take either an airport taxi or an app-based taxi to the conference venue. Taxis are readily available outside the Arrivals terminal and do not require advance booking. The approximate ride fare would be ₹900. Alternatively, you can take a bus service, KIAS 5 or KIAS 7, and stop at the Richmond Circle bus stop or the Mallaya Hospital bus stop for the respective routes. The hotel is about 700 m and 400 m from the respective bus stops.
From Bangalore City Railway Station

The hotel is 5 km from the Krantivira Sangolli Rayanna Railway Station (Bangalore City Railway Station). You could take an app-based taxi or an auto rickshaw to the conference venue. Taxis are readily available outside and do not require advance booking. There are multiple buses from the Majestic Bus stand (opposite the railway station) to the hotel. Find a suitable bus route here.


Hotel Website

We recommend that conference attendees stay at the conference venue, the ITC Gardenia. During the conference, lunch and refreshments are included both days. On November 28th, COMSOL will also host a gala dinner at the conference venue. There is free parking for conference attendees.

If you would like to explore other options for your stay near the conference venue, click here.

Get ready to connect, learn, and innovate. Join the top minds in science, physics, and engineering for 2 days of learning, talks by industry experts, and presentations featuring cutting-edge R&D.



Connect with the brightest minds in numerical simulation at the COMSOL Conference 2019 Bangalore.

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