Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
La modellazione e simulazione multifisica favorisce l’innovazione in numerosi settori industriali e nel mondo accademico, come dimostrano le molteplici applicazioni illustrate negli articoli tecnici e nei poster presentati ogni anno da ingegneri, ricercatori e scienziati alla COMSOL Conference.
Lasciati ispirare dai recenti contributi raccolti qui sotto oppure, per trovare una presentazione specifica o filtrare i risultati per area di applicazione, anno o sede della conferenza, utilizza lo strumento di Ricerca Rapida.
Visualizza gli articoli presentati alla COMSOL Conference 2025
Sustainable energy storage is essential for a successful energy transition towards renewable energies. Advanced future power grids will consist almost exclusively of instable and variable sources like solar and wind power. However, fluctuations are very problematic for the power grids, ... Per saperne di più
Ultra-thin flexible glass with thicknesses of 100 µm or below is bendable and has superior surface properties (Figure 1). The current use in foldable displays of mobile devices gives an idea of the range of possible applications [1]. However, it requires dedicated handling and processing ... Per saperne di più
Accurate determination of critical material properties is crucial in the nuclear industry. Ring tensile tests (RTT) have been extensively employed by Studsvik over the years to evaluate the mechanical properties of fuel cladding materials, with data analysis traditionally performed using ... Per saperne di più
Simulation of arc-wire additive manufacturing is under development in many academic and industrial sectors and at different scales. The study at the melt pool scale is often interesting to study deposition shapes and defects but not very relevant to calculate the stresses and strains at ... Per saperne di più
The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction requires a deep understanding of thermo-mechanical stresses imposed during the ... Per saperne di più
This research delves into an in-depth stress load analysis of suspension clamp assemblies employed within the realm of railway overhead electrification (OHE). These suspension clamp assemblies play a crucial role in securing catenary wires of varying diameters. They encounter diverse ... Per saperne di più
In the present-day manufacturing landscape, companies are shifting towards being sustainable. With a focus on addressing environmental concerns, many organizations are now embracing innovative solutions to minimize their carbon footprint. Among the significant challenges faced in this ... Per saperne di più
Today’s manufacturing industries like automobile, aerospace and Machine tools are demanding more accurate machined parts. Machine tool center has 40-70% of Machining error due to thermal issues. Temperature rise creates non-linear thermal deformation of machine. Significant cause of ... Per saperne di più
Piezoelectric materials are substances that can convert mechanical energy into electrical energy and vice versa. This is called the piezoelectric effect. When a piezoelectric material is squeezed or stretched, it creates an electric charge. This is because the material's atoms are ... Per saperne di più
This paper presents a detailed mechanical analysis of the high-strength surge arrestor PCA New Design for 2L+2L and other variations under cantilever loading. The study aims to evaluate the mechanical properties of the design and identify any issues or areas for improvement. The analysis ... Per saperne di più
