Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.
Visualizza gli articoli presentati alla COMSOL Conference 2020
The unique optical properties of plasmon resonances in noble metal nanoparticles have been extensively investigated owing to their ability to enhance the electric field amplitude but also to tailor its spectral and spatial distribution. Among all application domains, nonlinear optics ... Per saperne di più
Surface plasmon resonance (SPR) sensors proved themselves as a promising device for many kinds of applications such as optical biosensing, binding constant determinationor nanofilm thickness measurements. Here we simulate using COMSOL Multiphysics® the light-polaritons coupling for the ... Per saperne di più
We present numerical simulations for the propagation of surface plasmon polaritons in a dielectric-metal-dielectric waveguide using COMSOL Multiphysics® software. We show that the use of an active dielectric with gain that compensates metal absorption losses enhances substantially ... Per saperne di più
A contactless electromagnetic principle for the excitation of mechanical vibrations in resonant structures has been investigated. The principle relies on no specific magnetic property of the resonator except electrical conductivity and can be adopted for employing the structures as ... Per saperne di più
In this paper the heat transfer module in COMSOL is utilized to simulate internal heating of an Avalanche Photodiode due to light-induced current through a resistivity that depends on charge carrier concentrations in the device. Initial tests are done by modeling the heating process on a ... Per saperne di più
Established joining techniques like welding, soldering or brazing typically are characterized by a large amount of heat load of the components. Especially in the case of heat sensitive structures like MEMS this often results in stress induced deformation and degradation or even damaging ... Per saperne di più
Gallium nitride (GaN) and its related nitride alloys with special physical properties are in technical areas of high interest. The growing of gallium nitride boules on non-native sapphire or silicon carbide requires complicated mechanisms of defect reduction in the lattice structure. ... Per saperne di più
Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a ... Per saperne di più
Microcontact printing is a method for depositing patterns of thin films or molecular monolayers on surfaces using a polydimethylsiloxane (PDMS) stamp for selective mechanical contact (Figure 1). Undesired deformation of the stamp features during printing affects printed pattern quality. ... Per saperne di più
The dynamic behavior of droplet impingement on a solid surface is important to many engineering applications. This paper studied the dynamic behavior of a droplet impinging onto solid dry surfaces with different surface wettability using the COMSOL Multiphysics® software. The simulation ... Per saperne di più