Scopri come la simulazione multifisica viene utilizzata in tutto il mondo per ricerca e sviluppo
La modellazione e simulazione multifisica favorisce l’innovazione in numerosi settori industriali e nel mondo accademico, come dimostrano le molteplici applicazioni illustrate negli articoli tecnici e nei poster presentati ogni anno da ingegneri, ricercatori e scienziati alla COMSOL Conference.
Lasciati ispirare dai recenti contributi raccolti qui sotto oppure, per trovare una presentazione specifica o filtrare i risultati per area di applicazione, anno o sede della conferenza, utilizza lo strumento di Ricerca Rapida.
Visualizza gli articoli presentati alla COMSOL Conference 2026
Blade-tip clearance and turbine inlet temperature are critical efficiency parameters in turbomachinery design. Smaller clearances reduce leakage losses, but increase the risk of rubs between blades and the casing. Higher operating temperatures improve efficiency, but reduce the finite ... Per saperne di più
Additive Friction Stir Deposition (AFSD) is a solid-state additive manufacturing process capable of producing structural repairs with mechanical properties approaching those of wrought material, making it particularly attractive for restoring damaged aerospace components such as those ... Per saperne di più
We study energy distributions in unmodulated metal-dielectric-metal (MDM) structures. Two modes are observed: cavity mode and gap plasmon mode. The electric and magnetic fields behave differently in these modes. In the gap plasmon mode, electric energy is strongly confined in the ... Per saperne di più
Electrical dispersal deterrents are the most mature technology for deterring invasive species in open waterways. However, they pose human safety risks, incur high operational costs, and exhibit reduced efficacy against smaller fish. Consequently, current research focuses on optimally ... Per saperne di più
Capillary filling—the autonomous wicking of liquids through hydrophilic microchannels driven by surface tension and wettability—enables pump-free fluid handling in microfluidic devices for point-of-care diagnostics, lab-on-a-chip systems, and biomedical applications. A critical design ... Per saperne di più
The transition to glass-core PCB substrates is driven largely by electrical advantages — low dielectric loss, CTE match to silicon. The glass substrate itself is a substantially better thermal conductor compared to FR-4 epoxy (kglass ≈ 1.4 W/m·K vs. kFR4 ≈ 0.3 W/m·K), producing broader ... Per saperne di più
Compacted bentonite is widely investigated as an engineered buffer material for deep geological disposal systems because of its low hydraulic conductivity, swelling capacity, and self-sealing behavior. Under elevated temperatures, unsaturated bentonite buffers may undergo coupled thermo ... Per saperne di più
Stuck-pipe events remain among the costliest failure modes in drilling operations, contributing roughly one quarter of non-productive time and producing major financial losses across the oil and gas industry. Once the pipe becomes stuck, recovery is governed by a simple but decisive ... Per saperne di più
