Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.
Visualizza gli articoli presentati alla COMSOL Conference 2020
Indoor Thermal Analysis of a Storehouse
The aim of this study is to evaluate the airflow thermal distribution inside a storehouse in different operational conditions. A warehouse of 12,600 m3 in volume is considered for fluid-dynamical and thermal analysis. Coupled Navier-Stokes and energy equations are solved considering or ... Per saperne di più
Influence of Materials and Packaging Solutions on Thermal Behaviour of Power Modules
Nowadays, designing ever more efficient power modules requires complex materials and more innovative methodologies. To significantly reduce the lead time of the devices and decrease the costs, especially during the prototyping and the testing phases, a Finite Element Analysis (FEA) can ... Per saperne di più
Interaction of the Laser with the Material Modelling of the Micro-Lenses Creation
Micro-lenses with potential applications in optics on the surface of the various heavy-metal oxide glasses were created and studied experimentally [1-2]. Laser direct writing using continuous-wave laser emitting at 447 nm was successfully performed [2]. The aim of this study is to ... Per saperne di più
Introducing Kaleidosim cloudCompanion for COMSOL Multiphysics®
To this day seamless accessibility of local or cloud hardware for high performance computing as well as time consuming workflows involving sequencing and orchestration of available hardware for multiple simulation runs, remain limiting factors within the field of Multiphysics simulation ... Per saperne di più
Introduction of a Magneto‐Elastic Constitutive Law in COMSOL Multiphysics® for the Numerical Simulation of a Magneto‐Mechanical Characterization Setup
As part of its research, the Group of Electrical Engineering – Paris (GeePs) uses the COMSOL Multiphysics® software for applications such as material modelling in Electrical Engineering, electromagnetic compatibility and electromagnetic non-destructive testing. Some problems involve ... Per saperne di più
Investigation of Electromigration in Fine-Pitch Copper Interconnects through Simulation and Analysis
The scaling down of Copper interconnects is an effective approach to increasing the number of signal I/O lines and performance in advanced fine-pitch packaging. However, as dimensions are reduced, the risk of electromigration-induced failures in the copper interconnects becomes ... Per saperne di più
Investigation of the Electric Conductivity of an Electrically Heated Reactor
An electrically heated fixed bed (19 mm diameter, 200 mm length) is investigated regarding its electrical conductivity. Various electrically conductive activated carbons are used. The fixed bed is constructed from activated carbon pellets and/or activated carbon fabric. Electrical ... Per saperne di più
Investigations on Talik Formation During Changes to Cold Climates
Over the past million years, several cold ages have occurred and thereby caused perma-frost conditions basically all over the present area of Germany. Since in Germany the safe-ty of a nuclear waste repository legally needs to be investigated for a period of one million years, the ground ... Per saperne di più
Methanation in Catalytic Reactor
Power-to-gas is an important area of research for reducing greenhouse gases and seasonal energy storage. Methane, with a Lower Heating Value of 50 MJ/kg, is already a commonly used gas, and its synthesis using green hydrogen production (electrolysis of renewable energy) is a remarkable ... Per saperne di più
Modeling Electrochemical Deposition of Aluminum from Ionic Liquids for PCB Applications
While copper remains the dominant material for conduction paths in printed circuit board (PCB) applications, both technological and economic reasons have been motivating research on substituting copper with aluminum (Al). Despite its 60 % higher specific electrical resistance, aluminum ... Per saperne di più