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In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.

Visualizza gli articoli presentati alla COMSOL Conference 2020

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Modeling and Design of Material Inkjet Printer Ultraviolet LED Curing Cartridges Using COMSOL Multiphysics® for Printed Electronics Applications

M. Guvench[1], R. Wiswell[1]
[1]University of Southern Maine, Gorham, ME, USA

COMSOL Multiphysics® coupled with Solidworks® is employed to design, simulate and fabricate cartridges for a materials printer to accomplish in-situ curing of UV curable ink patterns as they are printed on flexible media for printed electronic circuit manufacturing. The cartridges ... Per saperne di più

Heat Propagation Improvement in YBCO-Coated Conductors for Superconducting Fault Current Limiters

D. M. Djokic[1], L. Antognazza[1], M. Abplanalp[2], M. Decroux[1]
[1]DPMC, University of Geneva, Geneva, Switzerland
[2]ABB Corporate Research Centre, Dättwil, Switzerland

YBCO Coated Conductors (CCs), used for applications in Resistive Superconducting Fault Current Limiters (RSFCLs), are known to have insufficiently high Normal Zone Propagation Velocity (NZPV) during quench events. The improvement can be made by enhancing the thermal conductivity of YBCO ... Per saperne di più

The Influence of Channel Aspect Ratio on Performance of Optimized Thermal-Fluid Structures

E.M. Dede
Toyota Research Institute of North America, Ann Arbor, MI, USA

Multiphysics optimization of thermal-fluid systems is an emerging area of interest with application to the development of high performance cooling technologies for electronic systems. This paper builds on previous work focused on the development of a computational platform for numerical ... Per saperne di più

Thermal Simulations of a LED Light Using COMSOL Multiphysics

M. Maaspuro[1]
[1]University of Turku, Turku, FInland

An experimental LED light composed of a multi-chip LED-module, a LED driver and an efficient heat sink, was investigated using COMSOL Multiphysics software and the Heat Transfer Module. In an LED light heat is mainly generated in the LEDs but some amount of heat is generated also in the ... Per saperne di più

Active Infrared Technique for Landmine Detection: Numerical and Experimental Results

P. Fallavollita[1,2], S. Esposito[1,2], and M. Balsi[1,2]
[1]Dipartimento di Ingegneria dell’Informazione, Elettronica e Telecomunicazioni, “La Sapienza” University, Rome, Italy
[2]Humanitarian Demining Laboratory, Cisterna di Latina, Italy

Landmines are an open problem in many countries of the world. They cause injuriesand death and no technique proposed to date guarantees fast and 100% reliable detection alone. To this purpose, at the Humanitarian Demining Laboratory of “La Sapienza” University of Rome, several solutions ... Per saperne di più

Thermal Model for Single Discharge EDM Process Using COMSOL Multiphysics

K. Gajjar[1], U. Maradia[2], K. Wegener[2]
[1]Indian Institute of Technology Bombay, Mumbai, Maharshtra, India
[2]Institute for Process Tools and Manufacturing (IWF), Zurich, Switzerland

Electrical Discharge Machining (EDM) is a non-conventional process used for machining electrically conducting materials. In die sink-EDM, sparks are generated between tool and workpiece resulting in heating of both electrode surfaces and creating a melt pool of metal which leads to ... Per saperne di più

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