Scopri come la simulazione multifisica viene utilizzata in tutto il mondo per ricerca e sviluppo
La modellazione e simulazione multifisica favorisce l’innovazione in numerosi settori industriali e nel mondo accademico, come dimostrano le molteplici applicazioni illustrate negli articoli tecnici e nei poster presentati ogni anno da ingegneri, ricercatori e scienziati alla COMSOL Conference.
Lasciati ispirare dai recenti contributi raccolti qui sotto oppure, per trovare una presentazione specifica o filtrare i risultati per area di applicazione, anno o sede della conferenza, utilizza lo strumento di Ricerca Rapida.
Visualizza gli articoli presentati alla COMSOL Conference 2026
The aim of this study is to evaluate the airflow thermal distribution inside a storehouse in different operational conditions. A warehouse of 12,600 m3 in volume is considered for fluid-dynamical and thermal analysis. Coupled Navier-Stokes and energy equations are solved considering or ... Per saperne di più
The throwing power is an important criterion for the industrial use of an electrolyte in electroplating applications. Using the Electrodeposition Module and COMSOL Multiphyiscs® it is possible to simulate the thickness distribution for various electroplating geometries. For a realistic ... Per saperne di più
To this day seamless accessibility of local or cloud hardware for high performance computing as well as time consuming workflows involving sequencing and orchestration of available hardware for multiple simulation runs, remain limiting factors within the field of Multiphysics simulation ... Per saperne di più
The aim of this investigation is to apply computational fluid dynamics simulations to support the design development of an impaction-based probe collector. This collector should allow submicron aerosol impactions in the supersonic free stream radially aside a sounding rocket body in the ... Per saperne di più
Over the past million years, several cold ages have occurred and thereby caused perma-frost conditions basically all over the present area of Germany. Since in Germany the safe-ty of a nuclear waste repository legally needs to be investigated for a period of one million years, the ground ... Per saperne di più
In this paper, we present a study of the simulation of Directed Energy Deposition (DED) Additive Manufacturing (AM) using a multiphysics approach. We use a combination of Heat Transfer in Fluids, Solid Mechanics and Laminar Flow physics to accurately simulate the DED process. The ... Per saperne di più
While copper remains the dominant material for conduction paths in printed circuit board (PCB) applications, both technological and economic reasons have been motivating research on substituting copper with aluminum (Al). Despite its 60 % higher specific electrical resistance, aluminum ... Per saperne di più
High power consumption chips have already become a major challenge for modern processors causing low thermal performances. Existing thermal solutions are not able to solve these high temperature issues efficiently. Two-phase cooling devices such as heat pipes and vapor chambers have ... Per saperne di più
