La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This model simulates arc welding of a titanium plate made from an alpha-beta titanium alloy. During a weld pass, the material experiences a thermal transient, including both heating and cooling. Phase transformations are modeled, and the evolution of the phase composition over time is ... Per saperne di più
Crimping is the plastic deformation process used to form an electrical joint between a stranded conductor and a terminal. The process involves complex multi-surface contact, including self-contact, as the terminal sleeve is plastically deformed around the wire strands. This example ... Per saperne di più
This model shows how to model a simple Metal–Insulator–Metal (MIM) diode. The two metal electrodes are defined on each side using the Metal Contact feature. Two studies were performed: one without quantum tunneling across the potential barrier and the other including it, using the WKB ... Per saperne di più
In a cooling system, a microelectronic component has been identified as the critical link. Since the power is repeatedly switched on and off, the component is subjected to thermal cycling. As a results a crack grows through a solder joint and disconnects the chip from the printed circuit ... Per saperne di più
A magnetic brake consists of a permanent magnet, which induces currents in a rotating copper disk. The resulting eddy currents interact with the magnetic flux to produce Lorentz forces and subsequently a braking torque. The disk angular velocity is computed using Simulink®. Per saperne di più
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Per saperne di più
The modal dispersion in a metamaterial can be engineered by changing the type of material and dimension of the composing unit cells. For instance, a periodically organized subwavelength metal–dielectric layered metamaterial exhibits an anisotropic dispersion characteristic in the ... Per saperne di più
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach, the thin domains are modeled with thermal resistors in the Lumped Thermal System ... Per saperne di più
This tutorial model solves the Gross–Pitaevskii Equation for the vortex lattice formation in a rotating Bose–Einstein condensate bound by a harmonic trap. The equation is essentially a nonlinear single-particle Schrödinger Equation, with the inter-particle interaction represented by a ... Per saperne di più
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Per saperne di più
