La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This model shows how to model the avalanche breakdown due to the impact ionization in a Silicon Carbide diode. The current-voltage (I-V) characteristics of the device are presented as well as the electric field distribution plot. Furthermore, the carrier generation term has been computed ... Per saperne di più
This model simulates arc welding of a titanium plate made from an alpha-beta titanium alloy. During a weld pass, the material experiences a thermal transient, including both heating and cooling. Phase transformations are modeled, and the evolution of the phase composition over time is ... Per saperne di più
This model illustrates the charge/discharge control of a Lithium-Ion battery in a Simulink® simulation. Per saperne di più
This tutorial demonstrates how to model the band-to-band tunneling across a p–n junction. The tunneling effect is imitated by defining the User-Defined Recombination domain feature which makes the electrons disappear from the conduction band on the n-side and holes disappear from the ... Per saperne di più
This tutorial example is kindly provided by Dr. James Ransley at Veryst Engineering, LLC. This model continues from the base model “A Micromachined Comb-Drive Tuning Fork Rate Gyroscope”, which is also provided by Dr. Ransley. The model demonstrates how to accurately compute the effects ... Per saperne di più
A plane electromagnetic wave is incident on a metallic sphere partially embedded on a substrate. In this electromagnetic scattering problem, the far-field variables are computed for a few elevation angles of incidence. Per saperne di più
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... Per saperne di più
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Per saperne di più
This example illustrates the principle of wet chemical etching for 2D geometry under laminar flow. The purpose of this tutorial is to examine how the copper substrate material is depleted and how the cavity shape evolves during the wet etching process. Wet chemical etching is ... Per saperne di più
This model computes the temperature distribution in a battery pack that is in use at a specified power. The current is controlled in Simulink® to ensure constant power during usage. Per saperne di più