La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
In this example, phase transformation data and phase material properties are imported from JMatPro, and used to compute CCT curves. Dilatometry curves (axial thermal strain) are computed across a range of cooling rates. Per saperne di più
A 3D model is used to simulate the cooling of a bevel gear from an austenitic state. Phase material properties and phase transformation data are imported into the model. The final phase composition and the residual stress state are computed. Phenomena such as thermal strains, phase ... Per saperne di più
This model analyzes the operation of a micromirror in air and the effects of thermoviscous damping on the vibration response. The model includes thermal losses in the structure as well as thermoviscous acoustic phenomena. The model couples the Thermoelasticity multiphysics interface to ... Per saperne di più
This model serves the purpose of validation and verification of the Linear Elastic Material, Layered model in the Shell interface. In COMSOL Multiphysics, composites are analyzed either based on Layerwise 3D elasticity theory through the Layered Shell interface or based on FSDT-ESL ... Per saperne di più
This model demonstrates how to set up a phase field damage multiphysics model to predict crack propagation in thermoelastic solids under large deformations. The crack-driving force depends on the principal stresses, which in turn depend on the temperature distribution in the solid ... Per saperne di più
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Per saperne di più
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... Per saperne di più
This model demonstrates an integrated structural-thermal-optical performance (STOP) analysis of an optical system. The Petzval Lens tutoral is used as the basis for this model, together with a simple barrel geometry The isothermal model performs a Parametric Sweep over several uniform ... Per saperne di più
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Per saperne di più
The following example solves a pure conduction and a free-convection problem in which a vacuum flask holding hot coffee dissipates thermal energy. The main interest is to calculate the flask's cooling power; that is, how much heat it loses per unit time. This tutorial model treats the ... Per saperne di più