La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This model analyzes the nonlinear transfer impedance of a tapered orifice that can be part of a perforate or microperforated plate (MPP). The analysis is carried out for various degrees of tapering of the perforate and for a frequency range. A linear analysis is set up in the frequency ... Per saperne di più
This tutorial model demonstrates how to compute the impedance of a capacitively coupled plasma. The Time Periodic study computes the time periodic solution of the plasma. Subsequently, the solution is transformed to the time domain, after which the fast Fourier transform (FFT) solver is ... Per saperne di più
The COMSOL® software includes capabilities for 3D plasma modeling. In this example, a square coil is placed on top of a dielectric window and is electrically excited at 13.56 MHz. A plasma is formed in the chamber beneath the dielectric window, which contains argon gas at low ... Per saperne di più
A stationary 3D model of a generic fuel cell cathode describing the mass fraction distribution of oxygen, water, and nitrogen, as well as the current distribution. The model uses Darcy's Law to describe convection, and couples this to Maxwell-Stefan diffusivities to also describe mass ... Per saperne di più
Schottky Contact This benchmark simulates the behavior of an ideal Schottky barrier diode made of a tungsten contact deposited on a silicon wafer. The resulting J-V (current density vs. applied voltage) curve obtained from the model under forward bias is compared with experimental ... Per saperne di più
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... Per saperne di più
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... Per saperne di più
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... Per saperne di più
This model computes the ion energy distribution function (IEDF) for a commercial capacitively coupled plasma reactor. The results show good agreement with experimental data. Per saperne di più
This benchmark model simulates a GaAs nanowire using the self-consistent Schrödinger-Poisson theory to compute the electron density and the confining potential profiles. The predefined Schrödinger-Poisson multiphysics coupling feature is combined with the dedicated Schrödinger-Poisson ... Per saperne di più