La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
In this set of eight tutorial models and associated documentation, you can investigate the resistive, capacitive, inductive, and thermal properties of a standard three-core lead-sheathed XLPE HVAC submarine cable with twisted magnetic armor (500 mm2, 220 kV). The series includes a 2D, 2D ... Per saperne di più
Steel pipelines are often subjected to complex stress/strain conditions in the oil and gas industry. Additionally, pipes are subjected to significant longitudinal strain due to soil movement. For the elastoplastic stress simulation, the Solid Mechanics interface is used with the small ... Per saperne di più
One method of creating spring-like structures or inducing curvature in thin structures is to plate them to substrates that are under the influence of residual stresses. The plating process can control this stress even for similar materials. One such device is the electrostatically ... Per saperne di più
In this example, a settlement and heave analysis of a shallow foundation resting on an unsaturated soil stratum is conducted with the Modified Cam-Clay and Extended Barcelona Basic soil models. The effect of pore suction due to movements in the phreatic line and the resulting settlement ... Per saperne di più
This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics ... Per saperne di più
Microlithography lenses are used to project the image of an integrated circuit onto a silicon substrate. This tutorial demonstrates how to create a 21-element fused silica lens which has a NA of 0.56 which is designed to be used at a wavelength of 248nm. The lens, which has a total ... Per saperne di più
The model includes a compilation of benchmark examples included in the text book: Shape Memory Alloys: Modeling and Engineering Applications. D. Lagoudas Ed. Springer 2008. The model uses the Souza–Auricchio model and shows the thermomechanical properties of a NiTi alloy sample ... Per saperne di più
This 3D model example demonstrates the use of the Primary Current Distribution interface for modeling current distributions in electrochemical cells. In primary current distribution, the potential losses due to electrode kinetics and mass transport are assumed to be negligible, and ... Per saperne di più
In this example, the Bergstrom–Boyce material model is used to capture the nonequilibrium behavior of carbon-black-filled chloroprene rubber under a strain history that alternates compression with relaxation. Results are verified against experimental and numerical results taken from ... Per saperne di più
The thin low permittivity gap boundary condition is meant to approximate a thin layer of material with low relative permittivity compared to its surroundings. This boundary condition is available for electrostatic field modeling. This example compares the thin low permittivity gap ... Per saperne di più
