La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Per saperne di più
This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... Per saperne di più
This model shows how to compute an array of borehole heat exchangers (BHEs) for shallow geothermal energy production. The BHEs are simplified as line heat sinks with a uniform heat extraction rate. The array is embedded into a layered subsurface model with groundwater flow in one of the ... Per saperne di più
The layout of a district heating network is designed using topology optimization. Per saperne di più
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... Per saperne di più
Electronic equipment often has to be certified to function after having been subjected to a specified shock load. In this example, the effect of an 50g 11ms half sine shock on a circuit board is investigated using response spectrum analysis. The results are compared with a time domain ... Per saperne di più
Heat pipes are designed to transfer heat efficiently through vaporization, mass transfer, and condensation of a working fluid. They are found in a wide variety of applications where thermal control is of importance, with cooling of electronics being a prominent example. Inside a heat ... Per saperne di più
This model simulates the velocity of the ionic wind generated by a wire-to-wire corona discharge. Ionic wind, created by the movement of charged particles in an electric field, can be harnessed for various applications, including cooling electronic components and enhancing heat ... Per saperne di più
In modeling of transport by diffusion or conduction in thin layers, we often encounter large differences in dimensions of the different domains in a model. If the modeled structure is a so-called sandwich structure, we can replace the thinnest geometrical layers with a thin layer ... Per saperne di più
In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a ... Per saperne di più