La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This tutorial model solves the Gross–Pitaevskii Equation for the ground state of a Bose–Einstein condensate in a harmonic trap, using the Schrödinger Equation interface in the Semiconductor Module. The equation is essentially a nonlinear single-particle Schrödinger Equation, with a ... Per saperne di più
A thin-walled container made of rolled steel is subjected to an internal overpressure. As an effect of the manufacturing method, one of the three material principal directions — the out-of- plane direction — has a higher yield stress than the other two. Hill’s orthotropic plasticity is ... Per saperne di più
This example simulates Trichel pulses produced by negative corona discharge under a point-to-plate configuration. The electron density and the electric field are obtained, as well as the discharge current. The discharge current clearly shows the pulsating characters. Each current pulse ... Per saperne di più
This model demonstrates how to set up a fully coupled poroviscoelastic model of biological tissues. The model is benchmarked by simulating a cyclic uniaxial tension–compression test on human brain tissue. Per saperne di più
Heat pipes are designed to transfer heat efficiently through vaporization, mass transfer, and condensation of a working fluid. They are found in a wide variety of applications where thermal control is of importance, with cooling of electronics being a prominent example. Inside a heat ... Per saperne di più
Using a Fluid-Solid Interaction multiphysics interface, the behavior of a spring-loaded ball check valve is studied under varying functional and reverse flow. The fluid force acting on the ball opens the valve at the opening pressure. In the case of a reversed pressure, the ball comes ... Per saperne di più
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... Per saperne di più
The electrical insulation strength of gases is generally much lower than that of solids. Under normal operating conditions, electrical discharges—known as partial discharges—can occur in voids or cracks within a solid dielectric. This model simulates partial discharges in a spherical ... Per saperne di più
