La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This model shows how to set up a 3D simulation of a n-p-n bipolar transistor. It is a 3D version of the device shown in the Bipolar Transistor model, and demonstrates how to extend semiconductor modeling into 3D using COMSOL Multiphysics. As in the 2D version of this model, the device ... Per saperne di più
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... Per saperne di più
Interfacial failure by delamination or debonding can be simulated with a Cohesive Zone Model (CZM). This example shows the implementation of a CZM with a bilinear traction-separation law. It is used to predict the mixed-mode softening onset and delamination propagation in a composite ... Per saperne di più
This example models the transient heating, and final temperature, of a disc brake of a car in brake-and-release sequence. It is important to model the transient heating and the following convective cooling to determine the minimum interval between a series of similar brake engagements. ... Per saperne di più
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Per saperne di più
The metal-silicon-oxide (MOS) structure is the fundamental building block for many silicon planar devices. Its capacitance measurements provide a wealth of insight into the working principles of such devices. This tutorial constructs a simple 1D model of a MOS capacitor (MOSCAP). Both ... Per saperne di più
This model simulates a GaN based light emitting diode. The emission intensity, spectrum, and quantum efficiency are calculated as a function of the driving current. Direct radiative recombination across the band gap is modeled, as well as non-radiative Auger and trap-assisted ... Per saperne di più
This app demonstrates the following: Geometry parts and parametric geometries Dark theme Use of subwindows Material appearance visualization with environment reflections Report generation for both Microsoft® Word and Microsoft® PowerPoint Options for setting different mesh sizes ... Per saperne di più
This model shows how to set up a simple Bipolar Transistor model. The output current-voltage characteristics in the common-emitter configuration are computed and the common-emitter current gain is determined. Per saperne di più
The powder compaction process is becoming common in the manufacturing industry, thanks to its potential to produce components of complex shape and high strength. In this example, the compaction of iron powder to form an axisymmetric rotational flanged component is analyzed with capped ... Per saperne di più