La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
A steel ball is pressed down against a rubber membrane. When the contact pressure exceeds a certain value, the two parts start sticking together. When the ball is retracted, the membrane is pulled upwards in the bonded region. During the retraction, the bond is partially broken. This ... Per saperne di più
This model describes the corrosion of magnesium (Mg) alloys in physiological environments using a phase-field formulation. The approach couples Mg dissolution kinetics with ionic transport, enabling the transition from activation-controlled to diffusion-controlled regimes to be captured. ... Per saperne di più
This model showcases a nail penetration experiment into a layered battery. It couples the Solid Mechanics, Lithium-Ion Battery, and Heat Transfer interfaces. A nail is punched into a sandwiched battery consisting of two electrodes and a separator. As soon as the nail connects both ... Per saperne di più
This example shows how to model isotropic volumetric growth and atrophy of soft biological tissues. The artery is represented by a cylinder that is stretched and compressed due to an applied axial load. As a result, the tissue undergoes growth and atrophy. Per saperne di più
Through-silicon vias (TSVs) allow chips or wafers to be connected vertically, making TSV a crucial technology for 2.5D and 3D packaging. The basic structure of a TSV consists of a deep hole penetrating a silicon substrate, a filling metal (usually copper) in the deep hole, and an ... Per saperne di più
Flip-chip (FC) is one of the advanced forms of semiconductor device packaging that is widely used in today's semiconductor packages for its capability to minimize packaging size while enhancing electrical interconnection density and transmission performance. In FC devices, the active ... Per saperne di più
