La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This model demonstrates how to compute satellite temperature over multiple orbit periods by coupling Orbital Thermal Loads to Heat Transfer in Solids. The direct solar, albedo, and Earth infrared thermal loads are computed over a single orbit, and are periodically repeated over multiple ... Per saperne di più
This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... Per saperne di più
This example demonstrates how to set up the classical external-flow problem of solving for the high-speed, compressible, turbulent flow over the ONERA-M6 wing. The problem involves finding a steady-state solution of the flow field around the 3D, swept wing geometry, immersed in a ... Per saperne di più
This model shows how to simulate carburization and quenching of a steel gear. Diffusion of carbon into the surface of the gear affects the onset of martensitic transformation. Residual stresses are computed, and it is shown that high residual compressive stresses appear at the root of ... Per saperne di più
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... Per saperne di più
This model solves the fluid flow and heat transfer in a micro heat exchanger made of stainless steel. These types of heat exchangers are found in lab-on-chip devices in biotechnology and micro reactors, for example for micro fuel cells. The model takes heat transferred through both ... Per saperne di più
This model demonstrates the use of the Heat and Moisture Flow features for the simulation of superheated steam drying of a wood particle. A nonequilibrium formulation is used to compute the transport of the liquid water and vapor phases in the wood particle. Reference: Le, K. H., ... Per saperne di più
This benchmark model computes the load-carrying capacity of a one dimensional hydrodynamic slider bearing. The results are compared with analytic expressions obtained by solving the Reynolds equations directly in this simple case. Per saperne di più
When producing glass, the glass melt is cooled down through radiation to form the final shape, subjecting it to stresses. Numerical treatment of radiative heat transfer, using the Radiative Transfer Equation (RTE), helps to optimize this process. COMSOL Multiphysics provides three ... Per saperne di più
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Per saperne di più