New Functionality in Version 4.2a

  • New Electromechanics multiphysics interface that combines solid mechanics and electrostatics with a moving mesh to model the deformation of electrostatically actuated structures. Applications include:
  • Biased resonator computations with model and frequency-response analysis
  • Pull-in voltage computations
  • Improve and simplified modeling of thin-film damping using the new Thin-Film Damping. You can now add thin-film damping to a boundary directly in the Solid Mechanics interface. In a Fluid-Film Properties subnode you define the fluid properties, gas properties, and rarefaction effects. In a Border subnode you define the border condition: a pressure or a border flow. The Film-Damping Shell interface still exists for coupling film-damping and solid mechanics in the same way as in earlier versions using a multiphysics coupling.
  • New electromechanical models: A suite of 2D and 3D models of a biased resonator showing how to model a stationary analysis, the frequency response, the normal modes, the pull-in voltage, and the transient response.

Backward Compatibility vs. Version 3.5a

Film Damping

  • Perforated plates are not yet available. These have to be modeled in version 4.2a using the full geometric description or using equation view.