La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
Copper Deposition in a Through-Hole Via
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... Per saperne di più
Secondary Current Distribution in a Zinc Electrowinning Cell
This is a model of the secondary current distribution in a zinc electrowinning cell. The model investigates the impact on the current distribution when changing the electrode alignment in a parametric study. The geometry is in 2D. Per saperne di più
Ion-Exchange Membranes and Donnan Potentials
This model file was used for creating the plots featured in the blog post "How to Model Ion-Exchange Membranes and Donnan Potentials". Per saperne di più
Aluminum Anodization
When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... Per saperne di più
Electrodeposition of a Microconnector Bump in 2D
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... Per saperne di più
Decorative Plating
Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by dissolution of the anode surface. Per saperne di più
Electrodeposition on a Resistive Patterned Wafer
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated. Per saperne di più
Rotating Cylinder Hull Cell
Rotating cylinder Hull cells are an important experimental tool in electroplating and electrodeposition and are used for the measurement of nonuniform current distribution, mass transport, and throwing power of plating baths. The model reproduces the results for a commercially available ... Per saperne di più
Electrodeposition of an Inductor Coil
This example models the deposition of an inductor coil in 3D. The geometry includes the extrusion of the deposition pattern into an isolating photoresist mask, and a diffusion layer on top of the photoresist. The mass transfer of copper ions in the electrolyte has a major impact on the ... Per saperne di più
Potential Profile in Batteries and Electrochemical Cells
The purpose of this model is to visualize the electric potential in an electrochemical cell, for example a battery. This is done at OCV and during operation. In a battery, this would correspond to OCV, discharge, and recharge. The potential profile is explained both for cells with planar ... Per saperne di più