Presentazioni e Articoli Tecnici

In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.

Modeling the Behavior of Phased Arrays in Brain Tissue: Application to Deep Brain Stimulation

V. Valente[1], A. Demosthenous[1], and R. Bayford[2]

[1]Department of Electronic & Electrical Engineering, University College London, London, United Kingdom
[2]Department of Natural Sciences, Middlesex University, London, United Kingdom

Deep Brain Stimulation (DBS) is a therapeutic tool used for a number of neurological disorders including chronic pain, incontinence and movement disorders, such as Parkinson’s disease. DBS consists of the low-frequency stimulation of an area of the brain, known as basal ganglia. The stimulation is provided by clinical implant, consisting of a pulse generator and an electrode lead ...

Numerical Evaluation of Long-Term Performance of Borehole Heat Exchanger Fields

A. Priarone[1], S. Lazzari[1], and E. Zanchini[1]

[1]Dipartimento di Ingegneria Energetica, Nucleare e del Controllo Ambientale, Alma Mater Studiorum - Università di Bologna, Bologna, Italy

The long-term performance of double U-tube Borehole Heat Exchangers (BHEs) is studied numerically by considering three different time-dependent heat fluxes exchanged between each BHE and the ground. Since the temperature distribution along the vertical direction has a negligible influence on long-term BHE performance, the problem is studied by means of a 2D conduction model, where the energy ...

Current Density Simulations in the Electrodeposition from Ionic Liquids: Effects of the Conductivity

I. Perissi[1], C. Borri[1], S. Caporali[1], and A. Lavacchi[1]
[1]Department of Chemistry, University of Firenze, Sesto Fiorentino, FI, Italy

The overall goal of this work is the use of COMSOL Multiphysics® in the modeling of the current density distributions for the electrodeposition of aluminum coatings from ionic liquids. The local current distribution is strongly dependant on the conductivity and on the geometry of the galvanic cell and can only be computed by the numerical solution of the partial differential equations ...

COMSOL Multiphysics® Version 4

Svante Littmarck
President and CEO, COMSOL

Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied Mathematics from the Royal Institute of Technology in Stockholm. In 2004 he received an honorary doctoral degree from the Royal Institute of Technology.

Second Order Drift Forces on "Offshore" Wave Energy Converters

L. Martinelli[1], A. Lamberti[1], and P. Ruol[2]

[1]DISTART Idraulica, Università di Bologna, Bologna, Italy
[2]IMAGE, Università di Padova, Padova, Italy

Objective of this contribution is to present a procedure for evaluating second order drift forces on floating bodies, often the most important loading component for mooring design, in case of high waves propagating in relatively shallow water depths. The non linearity associated to this condition, which is typical of installations involving wave energy converters, makes this problem particularly ...

Chemical Reactions in a Microfluidic T-Sensor: Numerical Comparison of 2D and 3D Models

R. Winz[1][2], N. Schröder[1], W. Wiechert[1], and E. von Lieres[1]
[1]Institute of Biotechnology 2, Research Centre Jülich, Jülich, Germany
[2]Research Center for Micro and Nanochemistry, University of Siegen, Siegen, Germany

In recent years lab-on-microchip technology has become a powerful tool for micro-scale analysis of biochemical processes. In the studied system the overall process consists of transport, convection, diffusion, reaction and adsorption processes. Two compounds A and B, contained in a carrier fluid (buffer), are introduced into a reaction channel via a Y-shaped double-inlet. As the streams flow ...

Growth and Remodelling of Intracranial Saccular Aneurysms

A. Di Carlo[1], V. Sansalone[2], A. Tatone[3], and V. Varano[1]
[1]Modelling and Simulation Lab, Università Roma Tre, Roma, Italy
[2]Laboratoire de Mécanique Physique, Université Paris Est, Paris, France
[3]DISAT, Università degli Studi dell’Aquila, L'Aquila, Italy

We present a mechanical model a growing spherical shell suitable for predicting the evolution of a Saccular Cerebral Artery Aneurysms (SCAA). It relies basically on the Kröner-Lee decomposition, used to describe the interplay between the current and the relaxed configuration of body elements. Rupture or stabilization of a SCAA are the end effect of a number of biological mechanisms, still poorly ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

Handling Tessellated Free Shape Objects with a Morphing Mesh Procedure in COMSOL Multiphysics®

P. Franciosa[1] and S. Gerbino[2]
[1]Faculty of Engineering, University of Naples Federico II, Napoli, Italy
[2]Faculty of Engineering, University of Molise, Campobasso, Italy

Tessellated models are more and more used in several engineering fields. The need to use such models to quickly perform computer simulations related to coupled physical phenomena, implies the use of dedicated software, allowing to solve, into an integrated environment, multiphysics problems. In the present work, COMSOL Multiphysics® has been used and its ability to handle tessellated models ...

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