Presentazioni e Articoli Tecnici

In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.

Using COMSOL Multiphysics Capability for Engineering High Q MEMS Resonators

Amy Duwel
Charles Stark Draper Laboratory
Cambridge, USA

Micromechanical resonators are used in a wide variety of applications, including inertial sensing, chemical and biological sensing, acoustic sensing, and microwave transceivers. Despite the distinct design requirements for each of these applications, a ubiquitous resonator performance parameter emerges. This is the resonator’s Quality factor (Q), which describes the mechanical energy damping. ...

Electromagnetics at Optical and Microwave Frequencies using COMSOL Multiphysics

Howie Stuart
Bell Laboratories, Lucent Technologies
Whippany, USA

The flexibility of COMSOL Multiphysics enables a variety of computational approaches to be applied towards solving electromagnetic problems across the whole spectrum. I will describe techniques for studying resonant electromagnetic interactions in a range of structures, including materials with negative electric permittivity (metals at optical frequencies), and small microwave resonators and ...

Accurate geometry factor estimation for the four point probe method using COMSOL Multiphysics

Kalavagunta, A., Weller, R.A.
Vanderbilt University, Nashville, TN

The four-point probe is a tool for measuring the resistivity of a material by contact with its surface. The tool is widely used in the semiconductor industry and has applications both in research and manufacturing. The method though is quite sensitive to various paramaters like the substrate material, probe separation, probe depth etc. In this paper we show that COMSOL multiphysics can be used ...

Double Gate MOSFET modeling

Gidon, S.
CEA Grenoble Leti

We use the MOS transistor model from COMSOL as a template to do our own model of double gate MOSFET. At the present time, it seems that double gate devices- going to non-planar transistor architectures- could be a solution for sub-32nm nodes. In addition, new design flexibility is allowed when gates are not interconnected. However, appropriate models must be developed. In our investigation, we ...

In Situ electric field simulation in Metal/Insulator/Metal (MIM) capacitors.

Gaillard, N., Pinzelli, L., Gros-Jean, M., Bsiesy, A.

In recent years, a large variety of high dielectric constant materials has been studied as an alternative to silicon dioxide in order to improve the electrical properties in many integrated devices. The authors pointed out MIM electrical properties modifications such as current-voltage shift and the decrease in the voltage gap between the different conduction mechanisms voltage threshold while ...

Electrohydrodynamic flow modeling using FEMLAB

Karpov, S., Krichtafovitch, I.
Kronos Air Technologies, Redmond, Washington

Electrohydrodynamic flow is a flow of electrically neutral gas caused by corona-generated charged particles (ions) drifting through it. The operation principles of electrostatic fluid accelerators that use corona discharge phenomenon can be described as following. High voltage applied between high curvature corona electrode and low curvature collecting electrode provides condition for ionization ...

Finite-element Analysis of Properties in Real and Idealized Photonic Crystal Fibres, Application to Supercontinuum Generation

Gérôme, F., Viale, P., Tombelaine, V., Leproux, P., Auguste, J.L., Février, S., Blondy, J.M., Couderc, V.
IRCOM, CNRS UMR 6615, Limoges, France

Using a full-vector finite-element method, we calculate modal properties in index-guiding photonic crystal fibres. The influence of the deformation of the geometry in actual fibre structures is evaluated and compared to the idealized-model. These results are applied to the supercontinuum generation. Moreover, development of MATLAB softwares for FEMLAB 3.1 are presented.

Optimization of thin film heater/sensor design for miniature devices using finite element analysis

Hoang, V.N., Kaigala, G.V., Backhouse, C.J.
ECERF, University of Alberta, Edmonton, Alberta, Canada

Localized heating is poised to become an integral part of microfluidic devices in various life-science applications. This is catalyzed by the scale of economics, the advantageous fluidic behavior at small volumes, and the ever increasing need for rapid and high throughput assays for pharmaceutical industry and other combinatorialbased studies. For precision confined heating, thin film resistive ...

Numerical Simulation of Fluid Flow During Arc Welding

Carin, M.1, Favre, E.2
1 Laboratoire d’Etudes Thermiques Energétique et Environnement, Université de Bretagne Sud, Lorient, France
2 Comsol France, Grenoble, France

A 2D axisymmetric model of a melt pool created by an arc type heat source has been developed using FEMLAB. The model solves the coupled equations of laminar fluid flow and heat transfer to demonstrate the flow behaviour in the pool. The coupled effects of buoyancy and capillary forces are taken into account. The presence of the liquid – solid interface is modelled by two different ways: a ...

Modeling Thermal Stresses of Copper Interconnects in 3D IC Structures

Bentz, D.N., Zhang, J., Bloomfield, M., Lu, J-Q., Gutmann, R.J., Cale, T.S.
Rensselaer Polytechnic Institute

One of the key issues in developing higher density microelectronics devices is the impact of the stresses induced by thermal expansion mismatches of the materials used. We have examined, using FEMLAB, the stresses due to interwafer copper interconnects embedded in multilayer structures created by bonding two wafers using an organic low-k dielectric glue, benzocylcobutene (BCB). This work ...

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