La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.

Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.

Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.

Heat Transfer Modulex

Thermal Management of a Battery Pack Using a Phase Change Material

Thermal management of a battery pack is simulated considering two scenarios, air (natural convection) and phase change material (PCM) in the gap between the batteries. The PCM considered is a composite material of paraffin wax and graphite additive. Graphite is typically added for ... Per saperne di più

Heat Transfer in a Room with a Stove

This model represents a stove in a living room. A radiation study is performed with the Surface-to-Surface Radiation physics interface. It shows the intensity of the stove radiation received on different surfaces of the room. Per saperne di più

Power Transistor

In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a ... Per saperne di più

Thermal Contact Resistance Between an Electronic Package and a Heat Sink

This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... Per saperne di più

LED Bulb Cooling

This model describes the three heat transfer modes: conduction, convection, and radiation, combined with nonisothermal flow in a realistic geometry representing a light bulb and the surrounding air. The LED chips dissipate heat. The model computes the equilibrium temperature induced by ... Per saperne di più

Thermal-Stress Analysis of a Turbine Stator Blade

This example shows how to compute thermally induced stresses in a turbine stator blade using the Thermal Stress, Solid interface. The conditions within gas turbines are extreme. The pressure can be as high as 40 bar, and the temperature more than 1000 K. Any new component must therefore ... Per saperne di più

Modeling Laser Beam Absorption in Silica Glass with Beer-Lambert Law

This tutorial shows how to use the Radiative Beam in Absorbing Media interface (Heat Transfer Module) to model the attenuation of a laser light going through a sample of silica glass, and the heat source generated by the absorption. Per saperne di più

Condensation Risk in a Wood-Frame Wall

This 2D stationary model computes heat and moisture transport in a wall composed of different hygroscopic materials. A comparison with the Glaser method is given for the temperature and relative humidity solutions. The effect of the use of a vapor barrier is also investigated. Per saperne di più

Heat Transfer in a Surface-Mount Package for a Silicon Chip

All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Per saperne di più

Topology Optimization of a Heat Exchanger with Laminar Flow

This model demonstrates topology optimization of a 2D heat exchanger with laminar flow. The flow is pressure driven and the objective is to maximize the heat transfer. The density method is used with the (now) classical approach of a single design variable and two flow interfaces. ... Per saperne di più